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OKI Semiconductor MR26V51253L
32M-Word x 16-Bit or 64M-Word x 8-Bit Page Mode
FEDR26V51253L-02-02
Issue Date: APR. 8, 2005
P2ROM
PIN CONFIGURATION (TOP VIEW)
FEATURES
* * * * * * * * * 33,554,432-word x 16-bit / 67,108,864-word x 8-bit electrically switchable configuration Page size of 8-word x 16-Bit or 16-word x 8-Bit 3.0 V to 3.6 V power supply Random Access time 100 ns MAX Page Access time 35 ns MAX Operating current 80 mA MAX Standby current 5 mA MAX Input/Output TTL compatible Three-state output
A11 A10 A9 A8 A7 A6 A5 A4
1 2 3 4 5 6 7 8
70 CE# 69 A12 68 A13 67 A14 66 A15 65 Vcc 64 A16 63 A17 62 A18 61 A19 60 A20 59 A21 58 NC 57 NC 56 NC 55 NC 54 NC
A3 9 A2 10 A1 11 A23 12
PACKAGES
* MR26V51253L-XXXMB 70-pin plastic SSOP (P-SSOP70-500-0.80-K-MC)
NC 13 NC 14 NC 15 NC 16 NC 17 GND 18 NC 19 NC 20 NC 21 NC 22
70SSOP
53 GND 52 NC 51 NC 50 NC 49 NC 48 NC 47 A22 46 A24 45 OE# 44 D15/A-1 43 D7 42 D14 41 D6 40 D13 39 D5 38 D12 37 D4 36 Vcc
P2ROM ADVANCED TECHNOLOGY
P2ROM stands for Production Programmed ROM. This exclusive Oki technology utilizes factory test equipment for programming the customers code into the P2ROM prior to final production testing. Advancements in this technology allows production costs to be equivalent to MASKROM and has many advantages and added benefits over the other non-volatile technologies, which include the following; * Short lead time, since the P2ROM is programmed at the final stage of the production process, a large P2ROM inventory "bank system" of un-programmed packaged products are maintained to provide an aggressive lead-time and minimize liability as a custom product. * No mask charge, since P2ROMs do not utilize a custom mask for storing customer code, no mask charges apply. * No additional programming charge, unlike Flash and OTP that require additional programming and handling costs, the P2ROM already has the code loaded at the factory with minimal effect on the production throughput. The cost is included in the unit price. * Custom Marking is available at no additional charge.
NC 23 BYTE# 24 A0 25 D0 26 D8 27 D1 28 D9 29 Vcc 30 D2 31 D10 32 D3 33 D11 34 GND 35
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MR26V51253L / P2ROM
BLOCK DIAGRAM
A-1 x 8 / x 16 Switch CE# CE OE# OE BYTE#
A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 A20 A21 A22 A23 A24
Row Decoder
Memory Cell Matrix 32M x 16-Bit or 64M x 8-Bit
Address Buffer
Column Decoder
Multiplexer
Output Buffer
D0 D1
D2 D3
D4 D5
D6 D7
D8 D9
D10
D12
D14 D15
D11
D13
In 8-bit output mode, these pins are placed in a high-Z state and pin D15 functions as the A-1 address pin.
PIN DESCRIPTIONS
Pin name D15 / A-1 A0 to A24 D0 to D14 CE# OE# BYTE# VCC VSS NC Functions Data output / Address input Address inputs Data outputs Chip enable input Output enable input Word / Byte select input Power supply voltage Ground No connect
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FUNCTION TABLE
Mode Read (16-Bit) Read (8-Bit) Output disable Standby CE# L L L H OE# L L H BYTE# H L H L H L VCC 3.0 V to 3.6 V D0 to D7 DOUT D8 to D14 DOUT Hi-Z Hi-Z Hi-Z D15/A-1 L/H
: Don't Care (H or L)
ABSOLUTE MAXIMUM RATINGS
Parameter Operating temperature under bias Storage temperature Input voltage Output voltage Power supply voltage Power dissipation per package Output short circuit current Symbol Ta Tstg VI VO VCC PD IOS Condition -- Relative to VSS Ta = 25C -- Value 0 to 70 -55 to 125 -0.5 to VCC+0.5 -0.5 to VCC+0.5 -0.5 to 5 1.0 10 Unit C C V V V W mA
RECOMMENDED OPERATING CONDITIONS
(Ta = 0 to 70C) Max. Unit 3.6 V VCC+0.5 V 0.6 V
Parameter VCC power supply voltage Input "H" level Input "L" level
Symbol VCC VIH VIL
Condition VCC = 3.0 to 3.6 V
Min. 3.0 2.2 -0.5
Typ. -- -- --
Voltage is relative to VSS. : Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns. : -1.5V(Min.) when pulse width of undershoot is less than 10ns.
PIN CAPACITANCE
(VCC = 3.3 V, Ta = 25C, f = 1 MHz) Typ. Max. Unit -- 16 pF -- 400 -- 20
Parameter Input BYTE# Output
Symbol CIN1 CIN2 COUT
Condition VI = 0 V VO = 0 V
Min. -- -- --
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ELECTRICAL CHARACTERISTICS
DC Characteristics
(VCC = 3.0 V to 3.6 V, Ta = 0 to 70C) Typ. Max. Unit -- 10 A -- 10 A -- 5 mA -- 5 mA -- -- -- -- -- 80 VCC+0.5 0.6 -- 0.4 mA V V V V
Parameter Input leakage current Output leakage current VCC power supply current (Standby) VCC power supply current (Read) Input "H" level Input "L" level Output "H" level Output "L" level
Symbol ILI ILO ICCSC ICCST ICCA1 VIH VIL VOH VOL
Condition VI = 0 to VCC VO = 0 to VCC CE# = VCC CE# = VIH CE# = VIL, OE# = VIH f=5MHz -- -- IOH = -1 mA IOL = 2 mA
Min. -- -- -- -- -- 2.2 -0.5 2.4 --
Voltage is relative to VSS. : Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns. : -1.5V(Min.) when pulse width of undershoot is less than 10ns.
AC Characteristics
(VCC = 3.0 V to 3.6 V, Ta = 0 to 70C) Min. Max. Unit 100 -- ns -- 100 ns 35 -- ns -- 35 ns -- 100 ns -- 30 ns 0 20 ns 0 20 ns 0 -- ns
Parameter Address cycle time Address access time Page cycle time Page access time CE# access time OE# access time Output disable time Output hold time
Symbol tC tACC tPC tPAC tCE tOE tCHZ tOHZ tOH
Condition -- CE# = OE# = VIL -- -- OE# = VIL CE# = VIL OE# = VIL CE# = VIL CE# = OE# = VIL
Measurement conditions Input signal level--------------------------------- 0 V/3.0 V Input timing reference level -------------------- 1/2Vcc Output load --------------------------------------- 50 pF Output timing reference level ------------------ 1/2Vcc Output load
Output 50 pF (Including scope and jig)
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TIMING CHART (READ CYCLE)
Random Access Mode Read Cycle
tC Address tOH tCE CE# tCHZ tOE OE# tACC Dout Hi-Z Valid Data Valid Data Hi-Z tOHZ tOH tACC tC
Page Access Mode Read Cycle
tC A3 to A24 tPC A-1 to A2 (Byte mode) A0 to A2 (Word mode) tCE CE# tOE OE# tACC Dout Hi-Z Hi-Z tPAC tPAC tOHZ tCHZ tOH tPC
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PACKAGE DIMENSIONS
(Unit: mm)
P-SSOP70-500-0.80-K-MC
5
Notes for Mounting the Surface Mount Type Package
Package material Lead frame material Pin treatment Package weight (g) Rev. No./Last Revised
Epoxy resin 42 alloy Solder plating (5m) 2.15 TYP. 1/Nov. 13, 2002
The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).
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OKI Semiconductor
MR26V51253L / P2ROM
REVISION HISTORY
Document No.
Page Date Previous Edition - 1,4 Current Edition - 1,4 Final edition 1 Change tacc, tce to 100ns from 120ns Description
FEDR26V51253L-02-01 FEDR26V51253L-02-02
Dec. 7, 2004 Apr.8, 2005
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MR26V51253L / P2ROM
NOTICE 1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date. 2. The outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. When planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. 3. When designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. 4. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. 5. Neither indemnity against nor license of a third party's industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. No responsibility is assumed by us for any infringement of a third party's right which may result from the use thereof. 6. The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products are not, unless specifically authorized by Oki, authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. 7. Certain products in this document may need government approval before they can be exported to particular countries. The purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. 8. No part of the contents contained herein may be reprinted or reproduced without our prior permission. Copyright 2005 Oki Electric Industry Co., Ltd.
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